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SCA610-E23H1A murata electronics oy 1/11 www.muratamems.fi doc.nr. 82 1525 00 rev.a datasheet SCA610-E23H1A single axis accelerometer with analog interface the sca610 accelerometer consists of a silicon bulk micro machined sensing element chip and a signal conditioning asic. the chips are mounted on a pre-mo lded package and wire bonded to appropriate contacts. the sensing element and asic are protected with silicone gel and lid. the sensor has 8 smd legs (gull-wing type). features ? single +5 v supply ? current consumption 2.5 ma typical ? ratiometric output in relation to supply voltage (vdd = 4.75 v...5.25 v) ? enhanced failure detection features o digitally activated, true self-test by proof mass deflection using electrostatic force o memory parity check during power up, and self-test cycle. o built in connection failure detection ? digitally activated, true self-test by proof mass deflection using electrostatic force ? wide load drive capability (max. 20 nf) ? true dc response ? ? qualified according to aec-q100 standard applications sca610 product family is targeted to automotive applications with high stability and reliability requirements. typical applications include: ? electronic stab ility control (esc) ? engine vibration measurement ? roll over ? suspension ? inclination figure 1. functional block diagram. asic eeprom for calibration constants (32 bit, pari ty check ) measuremen t circuitry gain & filtering 4 programming lines for factory use only gnd v out sensing element digital sel f test input 5v supply
SCA610-E23H1A murata electronics oy 2/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a table of contents SCA610-E23H1A single axis accele rometer with analog interface .................................... 1 ? f eatures .............................................................................................................................. ...... 1 ? a pplications .............................................................................................................................. 1 ? t able of c ontents .................................................................................................................... 2 ? 1. ? electrical spec ifications ............................................................................................ 3 ? 1.1. ? a bsolute m aximum r atings ............................................................................................ 3 ? 1.2. ? p erformance c haracteristics ..................................................................................... 3 ? 1.3. ? o ffset and sensitivity calibration ................................................................................ 4 ? 1.4. ? e rror calculations ....................................................................................................... 4 ? 1.5. ? s upply voltage ............................................................................................................... 5 ? 1.6. ? e lectrical c onnection .................................................................................................. 6 ? 2. ? functional descr iption ............................................................................................... 7 ? 2.1. ? m easuring directions .................................................................................................... 7 ? 2.2. ? v oltage to acceleration conversion .......................................................................... 7 ? 2.3. ? r atiometric o utput ....................................................................................................... 7 ? 2.4. ? s elftest and failure detection modes ......................................................................... 7 ? 3. ? mechanical spec ification .......................................................................................... 9 ? 3.1. ? d imensions ...................................................................................................................... 9 ? 4. ? application information ............................................................................................ 10 ? 4.1. ? r ecommended pcb lay - out ......................................................................................... 10 ? 4.2. ? r eflow soldering ........................................................................................................ 11 ?
SCA610-E23H1A murata electronics oy 3/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 1. electrical specifications 1.1. absolute maximum ratings parameter value units acceleration (powered or non-powered) 20 000 (1 g supply voltage ? 0.3 to +7.0 v voltage at input / output pins ? 0.3 to v dd + 0.3 v esd hbm (human body model) ? 2 kv esd cdm (charged device model) ? 500 middle pins ? 750 corner pins v temperature range (storage) ? 50 to +125 c temperature range (operating) ? 40 to +125 c 1 equals to drop from 1 meter on a concrete surface. 1.2. performance characteristics v dd = 5.00 v and ambient temperature unless otherwise specified. kpc a) parameter condition min. typ max. units measuring range nominal ? 1.5 +1.5 g supply voltage vdd 4.75 5.0 5.25 v current consumption vdd = 5 v; no load 2.5 4.0 ma operating temperature ? 40 +125 c resistive output load vout to vdd or vss 20 k ? capacitive load vout to vdd or vss 20 nf min. output voltage; vdd = 5 v 20k from vout to vdd 0 0.25 v max. output voltage; vdd = 5 v 20k from vout to vss 4.75 5.00 v offset (output at 0 g) @ room temperature vdd/2 v sensitivity @ room temperature 1.333 (0.267*vdd) v/g offset error (output at 0 g) ? 40 c...125 c ? 125 0 +125 mg sensitivity error ? 25 c...85 c ? 3 0 +3 % ? 40 c...125 c ? 5 0 +5 % typical non-linearity within the measuring range ? 20 +20 mg amplitude response ? 3 db b) 20 50 80 hz ratiometric error vdd = 4.75 v...5.25 v ? 2 +2 % cross-axis sensitivity @ room temperature 3.9 % output noise from dc...4 khz 5 mv rms start-up delay reset and parity check 10 ms self test pull down resistor (internal) 44 62 80 k ? a. cc= critical characteristics. mu st be 100% monitored during production sc= significant characteristic. the process capability (cpk) must be better than 1.33, which allows sample based testing. if process is not capable the part will be 100% tested b. output has true dc response
SCA610-E23H1A murata electronics oy 4/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 1.3. offset and sensi tivity calibration vout offset is calibrated in 0g position: ? ? g v offset out 0 ? [v] nominal offset is vdd/2: 2 dd nom v offset ? [v] sensitivity is calibrated as: ?? ? ? g g v g v y sensitivit out out 2 1 1 ? ? ? ? [v/g] nominal sensitivity is: 2 , 1 ? nom y sensitivit [v/g] 1.4. error calculations total error is the allowed maximum error, which include partial error sources. total error over lifetime is specified as a sum of offset and sensitivity errors: error y sensitivit error offset error total _ _ _ ? ? [mg] offset error is specified as: ?? y sensitivit v g vout error offset dd 2 0 _ ? ? [mg] sensitivity error percent is specified as: ? ? ? ? ?? % 100 2 1 1 % _ ? ? ? ? ? ? nom nom y sensitivit y sensitivit g g vout g vout error y sensitivit sensitivity error is specified as: ? ? ?? y sensitivit error y sensitivit g vout vout error y sensitivit % _ 0 _ ? ? ? [mg]
SCA610-E23H1A murata electronics oy 5/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 1.5. supply voltage usage of external 100 nf power suppl y bypass capacitor is recommended. asic start-up should be tolerant to noise between vdd and gnd. recommended power-up ramp is presented below. parameter min max t 1 t 0 + 0.1 s t 2 t 0 + 100 s v 1 ? 0.3 v 0.5 v v 2 4.5 v 5.5 v supply voltage ramp at startup. figure 2. v dd start-up sequence. t 0 t 1 t 2 supply voltage v 2 t v 1
SCA610-E23H1A murata electronics oy 6/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 1.6. electrical connection the following is minimum requirement for electric al interface to the sca610. if over-voltage or reverse polarity protection is needed, please contact vti technologies oy for application information. usage of external minimum 100 nf power supp ly bypass capacitor is recommended. maximum rise time of v dd is 100 ms. if self-test (pin 6) is not used it should be left floating. pins 1, 2, 3, and 5 are left floating. figure 3. electrical connection of sca610 component. pin # pin name i/o function connection on pcb 1 clk float / not connected 2 c1 float / not connected 3 mode float / not connected 4 gnd supply negative supply voltage (v ss ) ground 5 pgm float / not connected 6 st input self-test control float when not used 7 vout output sensor output vo ltage measuring circuit input 8 vdd supply positive supply voltage (v dd ) vdd (+5v) gnd vdd min. 100nf 8 7 6 5 1 2 3 4 sca610 vout
SCA610-E23H1A murata electronics oy 7/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 2. functional description 2.1. measuring directions 2.2. voltage to accele ration conversion analog output can be transferred to accelerati on using the following equation for conversion: ?? y sensitivit g v v on accelerati out out 0 ? ? [g] where: v out (0g) = nominal output of the device at 0g po sition with 5 v supply voltage (ratiometric output), sensitivity is the s ensitivity of the device and v out is the output of the sensor. 2.3. ratiometric output ratiometric output means that the zero offset point and sensitivity of the sensor are proportional to the supply voltage. if the sca6x0 supply voltage is fluctuating the sca6x0 output will also vary. when the same reference voltage for both the sca6x0 sensor and the measuring part (a/d- converter) is used, the error caused by referenc e voltage variation is automatically compensated for. 2.4. selftest and fa ilure detection modes to ensure reliable measurement results the sca6 x0 has continuous interconnection failure and calibration memory validity detection. a detected fa ilure forces the output signal close to power supply ground or vdd level, outside the normal output range. the calibration memory validity is verified by co ntinuously running parity check for the control register memory content. in the case where a par ity error is detected, the control register is automatically re-loaded from the eeprom. if a new parity error is detected after re-loading data analog output voltage is forced to go close to ground level (<0.25 v). the sca6x0 also includes a separate self test mode. the true self test simulates acceleration, or deceleration, using an electrostatic force. the elec trostatic force simulates acceleration that is high enough to deflect the proof mass to the extreme posi tive position, and this causes the output signal to go to the maximum value. the self test functi on is activated by a separate on-off command on the self test input. -1 g position v out,nom = 1.3 v 0 g position v out,nom = 2.5 v +1 g position v out,nom = 3.7 v + - + -
SCA610-E23H1A murata electronics oy 8/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a the self-test generates an electrostatic force, def lecting the sensing element?s proof mass, thus checking the complete signal path. the true self test performs following checks: ? sensing element movement check ? asic signal path check ? pcb signal path check ? micro controller a/d and signal path check the created deflection can be seen in analogue outpu t. self test can be activated applying logic?1? (positive supply voltage level) to st pin (pins 6) of sca6x0. the self test input high voltage level is 4 ? vdd+0.3 v and input low voltage level is 0.3 ? 1 v. figure 7. self test wave forms. v1 = initial output voltage before the self test function is activated. v2 = output voltage during the self test function. v3 = output voltage after the self test function has been de-activated and after stabilization time please note that the error band specified for v3 is to guarantee that the output is within 5% of the initial value after the specified stabilization ti me. after a longer time (max. 1 second) v1=v3. t1 = pulse length for self test activation t2 = saturation delay t3 = recovery time t4 = stabilization time =t2+t3 t5 = rise time during self test. t1 [ms] t2 [ms] t3 [ms] t4 [ms] t5 [ms] v2: v3: 10-100 typ. 20 typ. 50 typ. 70 typ. 10 min 0.95*vdd (4.75v @vdd=5v) 0.95*v1- 1.05*v1 self test characteristics. vout 5v 0 v t ime [ ms ] t1 t2 t3 t4 v1 v2 v3 st pin voltage 0 v 5 v t5
SCA610-E23H1A murata electronics oy 9/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 3. mechanical specification lead frame material: copper plating: nickel followed by gold solderability: jedec standard: jesd22-b102-c co-planarity: 0.1 mm max. the part weights: ~0.73 g 3.1. dimensions figure 8 . mechanical dimensions [mm].
SCA610-E23H1A murata electronics oy 10/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 4. application information the sca6x0 should be powered from a well regulated 5 v dc power supply. coupling of digital noise to the power supply line should be minimize d. 100nf filtering capacitor between vdd pin 8 and gnd plane must be used. if regulator is plac ed far from component for example other pcb it is recommend adding more capacitance between vdd and gnd to ensure current drive capability of the system. for example 470 pf and 1uf capacitor can be used. the sca6x0 has a ratiometric output. to get the best performance use the same reference voltage for both the sca6x0 and analog/digital converter. locate the 100nf power supply filtering capacitor close to vdd pin 8. use as short a trace length as possible. connect the other end of capacitor directly to the ground plan e. connect the gnd pin 4 to underlying ground plane. use as wide ground and power supply planes as possible. avoid narrow power supply or gnd connection strips on pcb. 4.1. recommended pcb lay-out figure 9. recommended pcb lay-out [mm]. notes: ? it is important that the part is parallel to t he pcb plane and that there is no angular alignment error from intended measuring dire ction during assembly process. ? 1 mounting alignment error will increase the cross-axis sensitivity by 1.7% ? 1 mounting alignment error will change the output by 17 mg ? wave soldering is not recommended ? ultrasonic cleaning is not allowed ? a supply voltage by-pass capacitor (> 100 nf) is recommended
SCA610-E23H1A murata electronics oy 11/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a 4.2. reflow soldering the sca6x0 is suitable for sn-pb eutectic and pb- free soldering process and mounting with normal smd pick-and-place equipment. recommended body temperature profile during reflow soldering: figure 10. recommended body temperature profile during reflow soldering. ref. ipc/jedec j-std-020d. profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (t smin ) - temperature max (t smax ) - time (min to max) (ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds tsmax to t l - ramp up rate 3c/second max time maintained above: - temperature (t l ) - time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature (t p ) 240 +0/ ? 5 c 250 +0/ ? 5 c time within 5 c of actual peak temperature (t p ) 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max 6 c/second max time 25 c to peak temperature 6 minutes max 8 minutes max the moisture sensitivity level of the part is 3 according to the ipc/jedec j-std-020d. the part should be delivered in a dry pack. the manufacturing floor time (out of bag) in the customer?s end is 168 hours.
SCA610-E23H1A murata electronics oy 12/12 www.muratamems.fi doc. nr. 82 1525 00 rev.a notes: ? preheating time and temperatures according to guidance from solder paste manufacturer. ? it is important that the part is parallel to the pcb plane and that there is no angular alignment error from intended measuring direction during assembly process. ? wave soldering is not recommended. ? ultrasonic cleaning is not allowed . the sensing element may be damaged by an ultrasonic cleaning process the moisture sensitivity level of the par t is 3 according to the ipc/jedec j-std- 020b. the part should be delivered in a dry pack. the manufacturing floor time (out of bag) in the customer?s end is 168 hour s. maximum soldering temperature is 250 c/40 sec. rework after the initial soldering process is not recommended. rework can cause heat build-up to the leg and this heat build-up will cause the housing material to get soft thus allowing the leg to move. the movement can cause bond wire disconnection inside the part.

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